SMT postopek tehnologije površinske pritrditve

Enostranski sklop
Incoming material inspection => Silk screen solder paste (sMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Inspection =>Predelava
Dvostranski sklop
A: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD PCB Silk screen solder paste (sMD glue) on PCB B side => SMD => Drying => Reflow soldering (preferably only on B side => Cleaning => Inspection =>Predelava).
B: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD => Drying (curing) => Reflow soldering on A side => Cleaning => Flip board => SMD glue on PCB B side => SMD => Curing => Wave soldering on B side => Cleaning => Inspection =>Predelava)
Ta postopek je primeren za refleksno spajanje na strani PCB A in valovno spajanje na strani B. Ta postopek je primeren za SMD, sestavljen na B strani PCB, kadar obstajajo samo sot ali soični (28) zatiči ali manj.
Enostranski postopek mešane montaže
Incoming material inspection => Screen printing solder paste on the A side of the PCB (applying SMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Plug-in => Wave soldering => Cleaning => Inspection =>Predelava
Dvostranski postopek mešane montaže
A: Incoming material inspection => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Plug-in on the A side of the PCB => Wave soldering => Cleaning => Inspection =>Predelava
Najprej nanesite in nato vstavite, kar je primerno za situacijo, ko je več komponent SMD kot diskretne komponente.
B: Incoming material inspection => Plug-in on the A side of the PCB (pin bending) => Flip board => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Predelava
Vstavite najprej in nato uporabite, kar je primerno za situacijo, ko je več diskretnih komponent kot SMD komponente.
C: Incoming material inspection => PCB A side screen printing solder paste => SMD => Drying => Reflow soldering => Plug-in, pin bending => Flip board => PCB B side SMD glue => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Predelamo stranski mešani sklop, b strani smd.
D: Incoming material inspection => PCB B side SMD glue => SMD => Curing => Flip board => PCB A side screen printing solder paste => SMD => Reflow soldering => Plug-in => Wave soldering => Cleaning => Inspection => Rework A side mixed assembly, B side SMD. First paste SMD on both sides, reflow soldering, then plug-in, wave soldering E: Incoming material inspection => Silk screen solder paste (smear patch glue) on the B side of the PCB => Smear => Drying (curing) => Reflow soldering => Flip board => Silk screen solder paste on the A side of the PCB => Smear => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (if there are few plug-in components, manual soldering can be used) => Cleaning => Inspection =>Predelamo stransko montažo, B Side Mexet Montaing.
Dvostranski postopek montaže
O: Pregled dohodnega materiala, pasta za spajkanje svilenega zaslona (lepilo za razmazovanje) na strani PCB, razmaz, sušenje (strjevanje), stransko reflow spajkanje, čiščenje, preliv; Pasta za spajkanje svilenega zaslona (lepilo za razmazovanje) na B strani PCB, razmaz, sušenje, reflow spajkanje (po možnosti samo za stran B, čiščenje, pregled, predelavo)
Ta postopek je primeren za namestitev velikih SMD, kot je PLCC na obeh straneh PCB.
B: Pregled dohodnega materiala, pasta za spajkanje na zaslonu na strani A PCB (nanašanje SMD lepila), SMD, sušenje (ozdravitev), refling spajkanje na strani A, čiščenje in prelivanje; Uporaba SMD lepila na strani B PCB, SMD, strjevanje, spajkanje valov na strani B, čiščenje, pregled in predelavo) Ta postopek je primeren za reflow na strani A PCB.